Semiconductor devices with dissimlar materials and methods

ABSTRACT

A method of manufacturing an electronic device includes providing a work piece comprising a first material, a first side, a second side opposite to the first side, and a first CTE. The method includes providing recesses extending into the work piece from the first side and comprising a pattern. The method includes providing a second material comprising a second CTE within the recesses and over the first material between the recesses. The method includes providing a third material comprising a third CTE over one of the second side or the second material. The third CTE and the second CTE are different than the first CTE.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of co-pending U.S. patentapplication Ser. No. 18/062,152 filed on Dec. 6, 2022, which is adivisional application of pending U.S. patent application Ser. No.16/948,491 filed on Sep. 21, 2020 and issued as U.S. Pat. No. 11,563,091on Jan. 24, 2023, which are hereby incorporated by reference andpriority thereto for common subject matter is hereby claimed.

TECHNICAL FIELD

The present disclosure relates, in general, to electronics and, moreparticularly, to semiconductor device structures and methods of formingsemiconductor devices.

BACKGROUND

Prior semiconductor devices and methods for forming semiconductordevices are inadequate, for example resulting in excess cost, inadequateintegration, decreased reliability, relatively low performance, ordimensions that are too large. Further limitations and disadvantages ofconventional and traditional approaches will become apparent to one ofskill in the art, through comparison of such approaches with the presentdisclosure and reference to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B illustrate respectively a top plan view and across-sectional view of a semiconductor device at a step of fabricationin accordance with the present description;

FIG. 2 illustrates a partial top plan view and a cross-sectional view ofthe semiconductor device of FIGS. 1A and 1B at an earlier step offabrication in accordance with the present description;

FIG. 3 illustrates a partial top plan view and a cross-sectional view ofthe semiconductor device of FIG. 2 at a later step of fabrication inaccordance with the present description;

FIG. 4 illustrates a cross-sectional view of a semiconductor device at astep of fabrication in accordance with the present description;

FIG. 5 illustrates a cross-sectional view of the semiconductor device ofFIG. 4 at a later step of fabrication in accordance with the presentdescription in a BST MIM capacitor example;

FIG. 6 illustrates a top plan view of a semiconductor device inaccordance with the present description;

FIGS. 7A, 7B, and 7C illustrate partial cross-sectional view of thesemiconductor device of FIG. 6 in accordance with example embodiments;

FIG. 8 illustrates a top plan view of a semiconductor structure inaccordance with the present description at a step in fabrication inaccordance with the present description;

FIG. 9 illustrates a cross-sectional view of the semiconductor structureof FIG. 8 ;

FIG. 10 illustrates a cross-sectional view of a silicon carbide (SiC)ingot for use with the semiconductor structure of FIGS. 8 and 9 ;

FIG. 11 illustrates a cross-sectional view of the semiconductorstructure of FIGS. 8 and 9 at a later step in fabrication in accordancewith the present description;

FIG. 12 illustrates a cross-sectional view of the semiconductorstructure of FIGS. 8 and 9 and still later embodiment in a SiC structureexample in accordance with the present description;

FIG. 13 illustrates a cross-sectional view of the semiconductorstructure of FIG. 12 after additional processing in accordance with thepresent description; and

FIG. 14 illustrates a cross-sectional view of the semiconductorstructure of FIG. 13 and further processing in accordance with thepresent description.

The following discussion provides various examples of semiconductordevices and methods of manufacturing semiconductor devices. Suchexamples are non-limiting, and the scope of the appended claims shouldnot be limited to the particular examples disclosed. In the followingdiscussion, the terms “example” and “e.g.” are non-limiting.

For simplicity and clarity of the illustration, elements in the figuresare not necessarily drawn to scale, and the same reference numbers indifferent figures denote the same elements. Additionally, descriptionsand details of well-known steps and elements are omitted for simplicityof the description.

For clarity of the drawings, certain regions of device structures, suchas doped regions or dielectric regions, may be illustrated as havinggenerally straight line edges and precise angular corners. However,those skilled in the art understand that, due to the diffusion andactivation of dopants or formation of layers, the edges of such regionsgenerally may not be straight lines and that the corners may not beprecise angles.

Although the semiconductor devices are explained herein as certainN-type conductivity regions and certain P-type conductivity regions, aperson of ordinary skill in the art understands that the conductivitytypes can be reversed and are also possible in accordance with thepresent description, taking into account any necessary polarity reversalof voltages, inversion of transistor type and/or current direction, etc.

In addition, the terminology used herein is for the purpose ofdescribing particular examples only and is not intended to be limitingof the disclosure. As used herein, the singular forms are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise.

As used herein, “current-carrying electrode” means an element of adevice that carries current through the device, such as a source or adrain of an MOS transistor, an emitter or a collector of a bipolartransistor, or a cathode or anode of a diode, and a “control electrode”means an element of the device that controls current through the device,such as a gate of a MOS transistor or a base of a bipolar transistor.

The term “major surface” when used in conjunction with a semiconductorregion, wafer, or substrate means the surface of the semiconductorregion, wafer, or substrate that forms an interface with anothermaterial, such as a dielectric, an insulator, a conductor, or apolycrystalline semiconductor. The major surface can have a topographythat changes in the x, y and z directions.

The terms “comprises”, “comprising”, “includes”, and/or “including”,when used in this description, are open ended terms that specify thepresence of stated features, numbers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, numbers, steps, operations, elements,components, and/or groups thereof.

The term “or” means any one or more of the items in the list joined by“or”. As an example, “x or y” means any element of the three-element set{(x), (y), (x, y)}. As another example, “x, y, or z” means any elementof the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y,z)}.

Although the terms “first”, “second”, etc. may be used herein todescribe various members, elements, regions, layers and/or sections,these members, elements, regions, layers and/or sections should not belimited by these terms. These terms are only used to distinguish onemember, element, region, layer and/or section from another. Thus, forexample, a first member, a first element, a first region, a first layerand/or a first section discussed below could be termed a second member,a second element, a second region, a second layer and/or a secondsection without departing from the teachings of the present disclosure.

It will be appreciated by one skilled in the art that words, “during”,“while”, and “when” as used herein related to circuit operation are notexact terms that mean an action takes place instantly upon an initiatingaction but that there may be some small but reasonable delay, such aspropagation delay, between the reaction that is initiated by the initialaction. Additionally, the term “while” means a certain action occurs atleast within some portion of a duration of the initiating action.

The use of word “about”, “approximately”, or “substantially” means avalue of an element is expected to be close to a state value orposition. However, as is well known in the art there are always minorvariances preventing values or positions from being exactly stated.

Unless specified otherwise, as used herein, the word “over” or “on”includes orientations, placements, or relations where the specifiedelements can be in direct or indirect physical contact.

Unless specified otherwise, as used herein, the word “overlapping”includes orientations, placements, or relations where the specifiedelements can at least partly or wholly coincide or align in the same ordifferent planes.

It is further understood that the examples illustrated and describedhereinafter suitably may have examples and/or may be practiced in theabsence of any element that is not specifically disclosed herein.

DETAILED DESCRIPTION OF THE DRAWINGS

Material science is an important aspect of semiconductor device designand processing. Stress and thermal expansion mismatch between dissimilarmaterials that are placed or stacked together in advanced semiconductorstructures can restrict device integration and performance capabilitiesfor such structures. Examples of semiconductor devices where theseissues exist include, but are not limited to, Metal-Insulator-Metal(MIM) capacitor structures on semiconductor materials, such as bariumstrontium titanate (BST) MIM capacitors on silicon; and heterojunctionsemiconductor materials, such as IV-IV semiconductor materials includingsilicon-carbide (SiC). More particularly, BST MIM capacitors aretypically formed on alumina substrates instead of more cost-effectivesilicon because alumina has a coefficient of thermal expansion (CTE)closer to that of BST than silicon. Silicon carbide has a CTE about 40%greater than that of silicon. This large mismatch in CTE together withthe high processing temperatures required for SiC has restricted theability to manufacture SiC devices on lower cost substrates, such assilicon. In addition, the large mismatch in CTE has caused devicefailures caused by, for example, metal delamination, shifting, and/orcracking.

In general, the present examples relate to semiconductor devicestructures and methods of making semiconductor devices that areconfigured to compensate for stress and CTE mismatch between materialsthat are placed or stacked together. The structures and methods areadaptable or tunable in accordance with the degree of CTE mismatchbetween the materials used in the structure. In some examples, recessedstructures are formed in a pattern on a substrate and refilled with oneor more dissimilar materials selected to resist or reduce susceptibilityto shear force. In other examples, the filled recessed structure is acontinuous recess region that is filled with a fill material, andportions of the substrate dispersed in a pattern within the filledrecess.

In accordance with the present description, the filled recessedstructures are configured to exhibit characteristics of the materialsused in the stack. The quantity, spacing, and dimensions of the recessesand the fill material type enable tuning and reduction of the stress andCTE mismatch. In some examples, the recessed structure is providedhaving polygonal shapes placed in, for example, a honeycomb pattern in atop plan view. In accordance with the present description, by adding thefilled recessed structure in a stack of dissimilar materials, improvedstructure resistance to CTE mismatch is achieved.

More particularly, in an example, a semiconductor device includes asubstrate comprising a first material, a first major surface, and asecond major surface opposite to the first major surface, the firstmaterial having a first coefficient of thermal expansion (CTE). A filledrecessed structure comprises recesses extending into the substrate andhaving a first pattern in a plan view, the recesses spaced apart so thatpart of the substrate is interposed between each of the recesses, and asecond material different than the first material in the recesses andhaving a second CTE. A structure is at the first major surface over thefilled recessed structure having a third CTE, wherein the third CTE andthe second CTE are different than the first CTE. In some examples, thestructure comprises a MIM capacitor. In other examples, the structurecomprises a heterojunction semiconductor region. In some examples, thefill material provides a current carrying electrode for thesemiconductor device.

In an example, a semiconductor device includes a substrate comprising afirst material, a first major surface, and a second major surfaceopposite to the first major surface, the first material having a firstcoefficient of thermal expansion (CTE). A filled recessed structureincludes a first recess filled with a second material having a secondCTE, the second material contiguous with the substrate in the firstrecess. A structure is at the first major surface over the filledrecessed structure and has a third CTE. The third CTE and the second CTEare different than the first CTE. The structure comprises one of ametal-insulator-metal (MIM) capacitor or a region of heterojunctionsemiconductor material. In examples, the filled recess structureincludes recesses including the first recess, which extend into thesubstrate and having a first pattern in a plan view, the recesses arespaced apart so that part of the substrate is interposed between each ofthe recesses. In some examples, the pattern can be a honeycomb pattern.

In an example, a method of forming a semiconductor device includesproviding a substrate comprising a first material, a first majorsurface, and a second major surface opposite to the first major surface.The first material having a first coefficient of thermal expansion(CTE). The method includes providing a filled recessed structurecomprising recesses extending into the substrate and having a firstpattern in a plan view, the recesses are spaced apart so that part ofthe substrate is interposed between each of the recesses; and a secondmaterial different than the first material is in the recesses and has asecond CTE. The method includes providing a structure at the first majorsurface over the filled recessed structure having a third CTE, whereinthe third CTE and the second CTE are different than the first CTE.

Other examples are included in the present disclosure. Such examples maybe found in the figures, in the claims, or in the description of thepresent disclosure.

FIG. 1A illustrates an enlarged top plan view of an electronic device10, a semiconductor device 10, semiconductor structure 10, or a stackedsemiconductor structure 10 having a filled recessed structure 21 at anearly step of fabrication. FIG. 1B illustrates an enlargedcross-sectional view of semiconductor device 10. In this example,semiconductor device 10 is described as a MIM capacitor stacked onto orformed onto a substrate or carrier structure. In the present example,the MIM capacitor is a BST MIM capacitor device. It is understood thatthe present description is relevant to other types of structures whereit useful to stack or form such structures onto a carrier or substratewhere the structure and the substrate comprise different materials withdifferent CTEs or different intrinsic stress levels. The MIM capacitoris one example of such a structure.

In some examples, semiconductor device 10 comprises a substrate 11,region of semiconductor material 11, or work piece 11 having a firstmajor surface 18 and a second major surface 19 opposite to first majorsurface 18. In some examples, substrate 11 can comprise silicon. Inother examples, substrate 11 can comprise other semiconductor materials,semiconductor-on-insulator (all) materials, ceramic materials, ormaterials desired to be stacked with other materials having differentthermal expansion coefficients compared to substrate 11. In otherexamples, substrate 11 may also be a carrier that is removed orpartially removed at a later stage of fabrication, for example afterhigh temperature processing is completed. In some examples, substrate 11is a high resistivity silicon substrate having a resistivity in a rangefrom about 1.5×10³ ohm-cm to about 1×10⁵ ohm-cm. In other examples,substrate 11 can include one or more doped regions or layers formedproximate to major surfaces 18 and/or 19, which can be formed usingepitaxial growth techniques, ion implantation and annealing techniques,or other doping techniques as known to one of ordinary skill in the art.

In some examples, filled recessed structure 21 includes recesses 23 ortrenches 23 in substrate 11 extending from major surface 18 inward intosubstrate 11. In some examples, recesses 23 extend only partially intosubstrate 11 and terminate before extending completely through substrate11. In some examples, recesses 23 are formed in a pattern 230 configuredto absorb or reduce stress in semiconductor device 10. In some examples,pattern 230 comprises a honeycomb pattern 230A as illustrated in FIG.1A. To optimize semiconductor device 10, the shapes (including those ina top plan view and in cross-sectional views), quantity, dimensions(width and depth), pitch, and spacing of recesses 23 can be selecteddepending on the types of materials used for substrate 11 and of thoseused for the structures to be stacked over substrate 11. As illustratedin FIG. 1B, recesses 23 can have a lower surface shape that is otherthan square, such as rounded or partially rounded.

In addition, the location of recesses 23 can be varied including, butnot limited to, configurations where: a) recesses 23 are placed indiscrete locations across major surface 18 or major surface 19, b)recesses 23 are placed across substantially all of major surface 18 ormajor surface 19, or c) recesses 23 are placed at peripheral edgeregions of major surface 18 or major surface 19. In some examples,recesses 23 can be formed at both major surface 18 and 19 in the same ordifferent configurations. In the present example of semiconductor device10, recesses 23 are placed at major surface 18 in regions where BST MIMcapacitors will be formed. In some examples, recesses 23 have a depth ina range from about 10 microns to about 100 microns and a width from 1micron to about microns.

Filled recessed structure 21 further includes a fill 231, fill material231, or stress-compensating material 231 in recesses 23. In accordancewith the present description, fill material 231 comprises a materialthat is dissimilar or different than substrate 11, although similarmaterials with different intrinsic stress also can be used. Such similarmaterials can be formed by depositing using different methods, such asdeposition temperature or deposition rate. Stated differently, fillmaterial 231 has a CTE that is different than substrate 11 and that issimilar to the CTE of the structure that will be provided over substrate11, or fill material 231 has a CTE that is between the CTE of substrate11 and the CTE of the structure that will be provided over substrate 11.In some examples, when substrate 11 comprises silicon, fill material 231can comprise silicon oxide (thermally grown, deposited, doped, orundoped), silicon nitride, metal nitrides, other semiconductormaterials, high k dielectric materials, low k dielectric materials,other materials suitable for high temperature semiconductor processingas known to one of ordinary skill in the art, including combinationsthereof. In the present example, fill material 231 can be silicon oxide,which has a CTE of 5×10⁻⁶ ° C.⁻¹, substrate 11 can be silicon, which hasa CTE of 2.6×10⁻⁶ ° C.⁻¹, and the structure that will be formed oversubstrate 11 can be BST MIM capacitor structure, which has a CTE of7.8×10⁻⁶ ° C.⁻¹.

In the past, alumina substrates have been used for BST MIM capacitorstructures, which have a CTE of 7.6×10⁻⁶ ° C.⁻¹. Alumina substrates havea disadvantage over silicon substrates including higher costs. In thepresent example, silicon oxide as fill material 231 provides a fillmaterial with CTE about half-way between substrate 11 comprising siliconand typical BST MIM capacitor structure.

Other considerations for fill material 231 include, but are not limitedto, materials that: a) do not induce warpage or other unwanted stresseswithin semiconductor device 10, b) use standard deposition techniques,c) can be patterned using processes known to one of ordinary skill theart, d) do not introduce unwanted contamination within wafer fabricationfacilities or to the structures provided over the filled recessedstructure, and e) do not add excessive costs. Fill material 231 can beformed using thermal processing, chemical vapor deposition (plasmaenhanced (PECVD) or low pressure (LPCVD)), atomic layer deposition(ALD), epitaxial growth techniques, sputtering, evaporation, plating, orother processing techniques as known to one of ordinary skill the art.

In some examples, fill material 231 can extend outside of recesses 23and can overlie portions of major surface 18 as generally illustrated inFIG. 1B. In other examples, a different material can be over majorsurface 18 between recesses 23 that is different than fill material 231.In some examples, fill material 231 can overlie the different materialat major surface 18 so that the different material is interposed betweenmajor surface 18 of substrate 11 and fill material 231 that is outsideof recesses 23.

In other examples, the configuration of FIG. 1A can be reversed so thatwhat is designated as elements 23 would become pillars 110A of substrate11, and the region between pillars 110A would be removed as a continuousrecess regions 23A, which is filled with fill material 231A. Stateddifferently, filled recessed structure 21 can comprise a continuousrecess region 23A having pillars 110A extending upward from a lowersurface of recess region 23A with fill material 231A in the recessregion 23A. As illustrated in FIG. 1A, pillars 110A are dispersed withinthe second material. In some examples, upper tips of pillars 110A can beexposed outside of fill material 231A. Pillars 110A can have shapessimilar to those described for recesses 23.

FIG. 2 illustrates a cross-sectional view of semiconductor device 10 atearlier step in fabrication prior to that illustrated in FIG. 1B. Insome examples, a dielectric 31, such as one or more dielectric layers isprovided at or over major surface 18 of substrate 11. In some examples,dielectric 31 comprises a thermal oxide having a thickness in a rangefrom about 2000 Angstroms to about 4000 Angstroms. In a next step, aphotolithographic process can be used to define pattern 230 for filledrecess structure 21. Such a process can include an exposed photoresistpattern that is developed to provide the desired pattern. In someexamples, honeycomb pattern 230A is provided by the photolithographicprocess. Next, portions of dielectric 31 are removed where dielectric 31is exposed through the pattern to expose portions of major surface 18 ofsubstrate 11.

Next, a removal step, such as an etch step is used to form recesses 23extending inward from major surface 18 into substrate 11. By way ofexample, recesses 23 can be etched using plasma etching techniques witha fluorocarbon chemistry or a fluorinated chemistry (for example,SF₆/O₂), or other chemistries or removal techniques as known to one ofordinary skill in the art. In accordance with the present description,portions 11A of substrate 11 remain between recesses 23. Stateddifferently, portions 11A of substrate 11 are interposed betweenrecesses 23. In some examples, remaining portions of dielectric 31 overmajor surface 18 are left in place. In other examples, the remainingportions of dielectric 31 can be removed before subsequent processing.

FIG. 3 illustrates a cross-sectional view of semiconductor device 10after further processing. In some examples, fill material 231 isprovided within recesses 23 and over major surface 18. In some examples,fill material 231 comprises a dielectric, such as a deposited oxide. Insome examples, fill material is a deposited oxide formed usingtetraethyl orthosilicate as a source. In some examples, the uppersurface of fill material 231 is planarized using chemical mechanicalprocessing (CMP) or other planarization techniques as known to one ofordinary skill in the art. As illustrated in FIG. 3 , in some examples,a portion of fill material 231 can remain over major surface 18 outsideof recesses 23. In accordance with the present description, withportions 11A of substrate 11 interposed between recesses 23, fillmaterial 231, which is in recesses 23, is also separated by portions11A. That is, fill material 231 is not provided as a continuous tub orregion of dielectric material. In addition, the spacing between recesses23 is chosen so that when fill material 231 comprises a thermal oxide,portions 11A are not consumed in the process so that part of portions11A remain to preserve individual recesses 23 as illustrated in FIG. 3 .In an alternate example, the area of recesses 23 and fill material canbe a continuously connected tub or region of dielectric, and the spacingbetween recesses would comprise disconnected and district pillars ofsubstrate 11.

FIG. 4 illustrates a cross-sectional view of semiconductor device 10after additional processing. In some examples, a structure 41 or BSTstack 41 is formed or stacked onto substrate 11 over filled recessedstructure 21. BST stack 41 includes one or more materials that aredissimilar to the material that substrate 11 comprises. In someexamples, BST stack 41 comprises a combination of conductive materialsand insulative materials provided in a laminate or layeredconfiguration. In some examples, BST stack 41 includes a first conductor410, a first insulator 411, a second conductor 412, a second insulator413, and third conductor 414.

In some examples, first conductor 410 can include an adhesion layer,such as a titanium layer, which can also be partially oxidized. Firstconductor 410 can further include a platinum layer over the titaniumlayer. First insulator 411 can comprise multiple layers of BST, whichcan include layers that are deposited and annealed before subsequent BSTlayers are formed. Second conductor 412 can include a layer of platinum,and second insulator 413 can comprise multiple layers of BST, which caninclude layers that are deposited and annealed before subsequent BSTlayers are formed. Third conductor 414 can comprise a layer of platinum.BST stack 41 can be formed using evaporation, sputtering, and otherdeposition techniques as known to one of ordinary skill in the artincluding combinations thereof.

FIG. 5 illustrates a cross-sectional view of semiconductor device 10after still further processing. In some examples, patterning processescan be used to pattern BST stack 41 to provide a plurality of BST MIMcapacitors 410A and 410B stacked over major surface 18 of substrate 11,and over filled recessed structures 21. In some examples, one or morephotolithographic steps and one or more etch steps are used to provideBST MIM capacitors 410A and 410B.

In some examples, filled recessed structures 21 can have a lateral widththat is larger than the lateral width of BST MIM capacitors 410A and410B as generally illustrated in FIG. 5 . In other examples, the lateralwidths can be substantially equal. In further examples, the lateralwidth of filled recessed structures 21 can be less than the lateralwidth of BST MIM capacitors 410A and 410B. An example of such anembodiment can be when the CTE mismatch between BST stack 41 andsubstrate 11 is not too large.

As described previously, in some examples BST MIM capacitors 410A and410B can have a CTE of about 7.8×10⁻⁶ ° C.⁻¹, fill material 231comprising silicon oxide can have a CTE of about 5×10⁻⁶ ° C.⁻¹ andsubstrate 11 comprising silicon can have a CTE of 2.6×10⁻⁶ ° C.³¹ ¹. Inaccordance with the present description, filled recess structures 21having fill material 231 within recesses 23 functions to compensate forstresses and CTE mismatch between BST MIM capacitors 410A/410B andsubstrate 11 that would exist and cause reliability/performance issuesfor semiconductor device 10 in the absence of filled recess structures21. It was found through experimentation that the present structureprovided significantly reduced delamination of the BST MIM capacitorstructures compared to prior structures using silicon substrates withoutfilled recessed structures as described herein.

FIG. 6 illustrates a top plan view of an electronic device 60, asemiconductor device 60, or a stacked semiconductor structure 60 havinga filled recessed structure 21 in accordance with the presentdescription. FIG. 7A illustrates a partial cross-sectional view ofsemiconductor device 60 in accordance with an example; FIG. 7Billustrates a partial cross-sectional view of semiconductor device 60 inaccordance with an example, and FIG. 7C illustrates a partialcross-sectional view of semiconductor device 60 in accordance with anexample.

In accordance with the present example, filled recessed structure 21 isprovided at an outer perimeter 61 of semiconductor device 60. Moreparticularly, filled recessed structure 21 is provided to surround orpartially surround an active area 62 of semiconductor device 60. In someexamples, semiconductor device 60 is configured as a power semiconductordevice, such as a metal-oxide-semiconductor field effect transistor(MOSFET) device having current carrying electrodes 64 and a controlelectrode 66 at a top side of semiconductor device 60. In some examples,another current carrying electrode 65 is provided at a lower side ofsemiconductor device 60 as illustrated in FIGS. 7A-7C. In some examples,filled recessed structure 21 is provided at perimeter 61 to provide apinning effect that reduces the movement of stacked dissimilar materialsproximate to the edge of semiconductor device 60. Examples of suchstacked dissimilar materials include a dielectric 67 and an insulatingpackaging material 68 illustrated in FIGS. 7A-7C. Other examples of suchstacked dissimilar materials can include a package substrate 69 asillustrated in FIGS. 7A-7C, which can be a lead frame substrate, aprinted circuit board substrate, a redistribution layer (RDL) substrate,other types of coreless substrates, a permanent core substrate, or othertypes of package substrates as known to one of ordinary skill in theart, and substrate 11 of semiconductor device 60, which can comprise asemiconductor material including silicon. In some examples, insulatingpackaging material 68 can be a polymer based composite material, such asepoxy resin with filler, epoxy acrylate with filler, or polymer with aproper filler. In some examples, insulating packaging material 68comprises an epoxy mold compound and can be formed using transfer orinjection molding techniques.

In the example of FIG. 7A, filled recessed structure 21 is provided atperimeter 61 adjacent to major surface 18 of substrate 11 ofsemiconductor device 60, which in the present example is a surfaceopposite to or distal to package substrate 69. Similar to semiconductordevice 10, filled recessed structure 21 comprises recesses 23, which canbe formed in a pattern 230 as illustrated in FIG. 5 , such as honeycombpattern 230A as illustrated in FIG. 1A. Fill material 231 is withinrecesses 23 and in some examples, extends out of recesses 23 andoverlaps portions of major surface 18. In this example, filled recessedstructure 21 can function to restrict movement of dielectric 67 andinsulating packaging material 68 proximate to perimeter 61. In thepresent example, fill material 231 can comprise fill materials asdescribed previously.

In the example of FIG. 7B, filled recessed structure 21 is provided atperimeter 61 adjacent to major surface 19 of substrate 11 ofsemiconductor device 60, which is proximate to package substrate 69Similar to semiconductor device 10, filled recessed structure 21comprises recesses 23, which can be formed in a pattern 230 asillustrated in FIG. 6 , such as honeycomb pattern 230A as illustrated inFIG. 1A. Fill material 231 is within recesses 23 and in some examples,extends out of recesses 23 and overlaps portions of major surface 19. Inthis example, filled recessed structure 21 can function to restrictmovement of substrate 11 and package substrate 69 or the movement ofdielectric 67 and insulating packaging material 68. In the presentexample, fill material 231 can comprises fill materials as describedpreviously. In some examples, the example of FIG. 7A can be combinedwith the example of FIG. 7B.

The example of FIG. 7C is similar to the example of FIG. 7B except fillmaterial 231 can comprise the material used for current carryingelectrode 65, a die attach material, a solder material, or combinationsof such materials; or can comprise fill materials as describedpreviously. In this example, filled recessed structure 21 can functionto restrict movement of substrate 11 and package substrate 69 or themovement of dielectric 67 and insulating packaging material 68. In someexamples, the example of FIG. 7A can be combined with the example ofFIG. 7C.

Turning now to FIGS. 8-14 , a structure and method is described forwhere the stacked structure comprises a heterojunction semiconductormaterial. In the present example, a heterojunction semiconductor deviceis described using a silicon-carbide (SiC) region or structure stackedonto a silicon substrate with a filled recessed structure filled with amaterial comprising SiC. Trends in the semiconductor industry suggestthat, based on technical and commercial factors and challenges, thedevelopment of a SiC film or structure on silicon base substrate is apromising approach for SiC devices to become more widely accepted in theindustry. A main technical challenge in the development of suchstructures is the relatively large mismatch in crystal-lattice constantsand CTEs.

FIG. 8 illustrates a top plan view of an electronic structure 80 or asemiconductor structure 80 in accordance with the present description.FIG. 9 illustrates a cross-sectional view of semiconductor structure 80.Semiconductor structure 80 comprises a substrate 81, work piece 81, orwafer 81 and a filled recessed structure 83. In the present example,substrate 81 comprises silicon, but it is understood that othermaterials can be used in other examples. Substrate 81 includes a majorsurface 88 and a major surface 89, which is opposite to major surface88.

Filled recessed structure 83 comprises recesses 91 or trenches 91extending from major surface 88 of substrate 81 inward into substrate81. Recesses 91 are spaced apart leaving portions of substrate 81interposed between adjacent recesses 91. In some examples, recesses 91are provided in a pattern 830, such as a honeycomb pattern 830A. In someexamples, pattern 830 extends to cover substantially all of majorsurface 88 leaving a small area at a perimeter 92 of substrate 81 absentrecesses 91. Filled recessed structure 83 further includes a fillmaterial 93 in recesses 91. In some examples, fill material 93 extendsout of recesses 91 and overlaps onto major surface 88. In some examples,fill material 93 forms a continuous film structure that extendssubstantially across all of major surface 88 including perimeter 92.Recesses 91 can be formed using similar processes as describedpreviously with recesses 23.

In accordance with the present example, fill material 93 comprises thesame or similar material as the structure to be stacked onto or formedonto substrate 81. That is, when the structure comprises aheterojunction semiconductor material, the fill material comprises aheterojunction semiconductor material. Specifically, in the presentexample, fill material 93 comprises SiC, which can be deposited overmajor surface 88 using low-pressure chemical vapor deposition (LPCVD) orother deposition techniques as known to one of ordinary skill the art.The CTE mismatch between SiC and silicon (3.7×10⁻⁶ ° C.⁻¹ versus2.6×10⁻⁶ ° C.⁻¹) is not as pronounced as the CTE mismatch between BSTand silicon; however, SiC devices require higher temperature processingthan BST MIM capacitors (e.g., 1300° C. versus 600° C.). In someexamples, it was observed that the higher temperature processingrequires a closer CTE balance between a region of SiC material 102(illustrated in FIG. 12 ) or the structure added subsequently tosubstrate 81. That is the CTE of the structure to be added is similar tothe CTE of the fill material, which is different than the CTE ofsubstrate 81. In some examples, the depth of recesses 91 is greatercompared to the depth of recesses 23 described previously. In someexamples, the depth of trenches 91 can be in a range from about 40microns to about 200 microns.

In addition to SiC, in some examples fill material 93 can comprise anoxide, a polycrystalline semiconductor material, such as polysilicon, orcombinations thereof including combinations with SiC. In accordance withthe present description, when fill material 93 comprises SiC, a postdeposition anneal in an inert atmosphere can be used at a temperature ofabout 1600° C. with anneal time adjusted to balance the resultingstress. In some examples, fill material 93 can be doped with a P-typeconductivity dopant (e.g., boron) or an N-type conductivity dopant(e.g., phosphorous, arsenic, or antimony). In other examples, fillmaterial 93 can comprise another heterojunction semiconductor materialthat has a CTE close to the CTE of the structure to be stacked ontosubstrate 81.

FIG. 10 illustrates a cross-sectional view of a SiC ingot 101. Oneprocess for providing a SiC wafer for semiconductor devices is theKabra® process available from DISCO Corporation of Tokyo, Japan. In theKabra process, a SiC ingot (e.g., SiC ingot 101) is exposed tocontinuous vertical laser irradiation at a specified depth to provide aseparation region 101A that defines a region of SiC material 102, aheterojunction semiconductor structure 102, or a SiC structure 102.

FIG. 11 illustrates a cross-sectional view of semiconductor structure 80after further processing. In some examples, substrate 81 is bonded toregion of SiC material 102 using wafer-to-wafer bonding. Stated anotherway, region of SiC material 102 can be stacked onto substrate 81adjacent to filled recessed structure 83 using a bonding process.Specifically, fill material 93 over major surface 88 of substrate 81 canbe bonded to region of SiC material 102 so that fill material 93 isinterposed between substrate 81 and region of SiC material 102. In someexamples, region of SiC material 102 and fill material 93 can beplanarized before the bonding step using, for example, chemicalmechanical planarization (CMP) techniques to achieve a root-mean-square(rms) roughness of less than about 0.2 nm. In some examples, surfaceactivation bonding can then be used under vacuum conditions to bondsubstrate 81 to region of SiC material 102 as known to one of ordinaryskill the art. Next, substrate 81 with region of SiC material 102 isremoved from SiC ingot where the continuous vertical laser irradiationprovided separation region 101A as illustrated in FIG. 12 .

FIG. 13 illustrates semiconductor structure 80 after additionalprocessing. In some examples, part of the top side of region of SiCmaterial 102 is removed including separation region 101A. In someexamples, grinding or CMP techniques can be used for the removal step.At this stage of fabrication, semiconductor structure 80 can be furtherprocessed in accordance with standard wafer processing techniques toprovide individual semiconductor components 80A across semiconductorstructure 80 as illustrated in FIG. 14 . Such wafer processingtechniques can form individual doped regions in region of SiC material102, can form isolation regions, can form dielectrics, and can formcontacts. In accordance with the present description, part of substrate81 can be removed from major surface 89 to expose lower sides of filledrecessed structure 83 including portions of fill material 93. When fillmaterial 93 is doped, fill material 93 can provide a contact region toeach of the semiconductor components 80A when semiconductor components80A are singulated to provide individual components. In some examples,such contact regions can be current carrying electrodes whensemiconductor components 80A comprise vertical devices. In otherexamples, fill material 93 is not exposed and a portion of substrate 81remains adjacent to the lower surfaces of trenches 91. In some examples,semiconductor components 80A comprises power semiconductor devices.Singulation lines 108 are an example of where semiconductor components80A can be separated into individual devices.

In accordance with the present description, filled recess structure 83is configured to reduce the stresses between region of SiC material 102and substrate 11 thereby reducing defects, such as delamination betweenthe materials even at higher process temperatures used for SiC devicemanufacturing.

It is understood that although silicon has been described as an examplesubstrate material and the structured formed onto the substrate isdescribes as SiC, the present description is relevant to other materialsincluding other heterojunction semiconductor materials, such as SiGe,SiGeC, GaAs, InGaP, GaN, and AN, for the substrate or the fill material.

In view of all of the above, it is evident that a novel structure andmethod are disclosed. Included, among other features, is a substratehaving a filled recessed structure and another structure stacked orprovided over the filled recessed structure. In some examples, thesubstrate has a first CTE, the filled recessed structure comprises afill material within recesses that a second CTE, and the structure has athird CTE. In some examples, the second CTE is selected to be betweenthe first CTE and the third CTE. The filled recessed structure isconfigured to reduce stresses between the structure and the substratethereby improving yields and reliability. In some examples, thestructure comprises a MIM capacitor. In other examples, the fillmaterial and the structure comprise one or more heterojunctionsemiconductor materials. For example, the structure can comprise aregion of SiC material and the substrate can comprise silicon.

While the subject matter of the invention is described with specificpreferred examples, the foregoing drawings and descriptions thereofdepict only typical examples of the subject matter and are not thereforeto be considered limiting of its scope. It is evident that manyalternatives and variations will be apparent to those skilled in theart. For example, the fill materials can comprise combinations ofmaterials that may be deposited individually and annealed deposited as aplurality of layers and annealed as a composite structure. Variousdeposition techniques can be used for the fill materials, includingsputtering, plating, evaporation, CVD, LPCVD, PECVD, MOCVD, ALD as wellas other deposition techniques known to one of ordinary skill in theart.

As the claims hereinafter reflect, inventive aspects may lie in lessthan all features of a single foregoing disclosed example. Thus, thehereinafter expressed claims are hereby expressly incorporated into thisDetailed Description of the Drawings, with each claim standing on itsown as a separate example of the invention. Furthermore, while someexamples described herein include some, but not other features includedin other examples, combinations of features of different examples aremeant to be within the scope of the invention and meant to formdifferent examples as would be understood by those skilled in the art.

What is claimed is:
 1. A method of manufacturing an electronic device,comprising: providing a work piece comprising a first material, a firstside, a second side opposite to the first side, and a first coefficientof thermal expansion (a first CTE); providing recesses extending intothe work piece from the first side and comprising a pattern; providing asecond material comprising a second CTE within the recesses and over thefirst material between the recesses; and providing a third materialcomprising a third CTE over one of the second side or the secondmaterial; wherein: the third CTE and the second CTE are different thanthe first CTE.
 2. The method of claim 1, wherein: providing the recessescomprises providing the pattern comprising a honeycomb pattern.
 3. Themethod of claim 1, wherein: providing the third material comprisesproviding an insulating packaging material.
 4. The method of claim 1,wherein: providing the second material comprises providing an insulatingmaterial.
 5. The method of claim 1, wherein: providing the firstmaterial comprises providing a semiconductor material.
 6. The method ofclaim 1, wherein: providing the third material comprising providing thethird material over the second material.
 7. The method of claim 1,wherein: providing the third material comprises providing the thirdmaterial over the second side of the work piece.
 8. The method of claim1, wherein: the third CTE and the second CTE are greater than the firstCTE.
 9. The method of claim 1, wherein: the second CTE is greater thanthe first CTE and less than the third CTE.
 10. A method of manufacturingan electronic device, comprising: providing a work piece comprising afirst material, a first side, and a second side opposite to the firstside, the first material comprising a first coefficient of thermalexpansion (a first CTE); providing a filled recessed structurecomprising: recesses extending into the first material and comprising apattern in a plan view, and a second material different than the firstmaterial in the recesses and comprising a second CTE; and providing athird material over one of the second material or the second side andcomprising a third CTE, wherein: the third CTE and the second CTE aredifferent than the first CTE; and each of the recesses comprises apolygonal shape in a top view.
 11. The method of claim 10, wherein: thethird CTE and the second CTE are greater than the first CTE.
 12. Themethod of claim 10, wherein: the second CTE is greater than the firstCTE and less than the third CTE.
 13. The method of claim 10, wherein:providing the filled recess structure comprises providing the secondmaterial extending out of the recesses and overlapping the firstmaterial interposed between the recesses.
 14. The method of claim 10,wherein: providing the third material comprises providing the thirdmaterial over the second material.
 15. The method of claim 10, wherein:providing the third material comprises providing the third material overthe second side of the work piece.
 16. The method of claim 10, wherein:providing the second material comprises providing the second materialcomprising one or more of GaN, AN, or InGaP.
 17. A method ofmanufacturing an electronic device, comprising: providing a work piececomprising a first material, a first side, a second side opposite to thefirst side, and a first coefficient of thermal expansion (a first CTE);providing recesses extending into the work piece from the first side andcomprising a pattern; providing a second material within the recessesand over portions of the first material outside of the recesses andinterposed between the recesses, wherein the second material comprises asecond CTE; and providing a third material over one of the second sideor the second material, wherein the third material comprises a thirdCTE; wherein: the third CTE and the second CTE are different than thefirst CTE.
 18. The method of claim 17, wherein: providing the firstmaterial comprises providing the first material comprising siliconcarbide (SiC).
 19. The method of claim 17, wherein: providing the secondmaterial comprises providing an insulating material; and providing thethird material comprising providing the third material over the secondside of the work piece.
 20. The method of claim 17, wherein: providingthe third material comprises providing the third material over thesecond material; providing the second material comprises providing adielectric; and providing the third material comprises providing aninsulating packaging material.